#Pat Gelsinger

[pressnewsagencyllc]

Intel's latest AI chip is a direct shot at Nvidia's moneymaker

Intel (INTC) on Tuesday debuted a new AI chip designed to take on one of Nvidia’s (NVDA) most popular AI processors as part of its Intel Vision event. The company’s Gaudi 3 chip matches and exceeds Nvidia’s H100 AI processor when it comes to training and deploying generative AI models. The H100 is one of Nvidia’s most popular chips, powering artificial intelligence applications for some of the…

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#Gaudi #intel #Nvidia #Pat Gelsinger

[thelegend9798]

Intel shareholders reject executive pay

Intel shareholders reject executive pay

Patrick Gelsinger, chief executive officer of Intel Corp., speaks during a Bloomberg Studio 1.0 interview at the company’s headquarters in Santa Clara, California, Feb. 3, 2022. David Paul Morris | Bloomberg | Getty Images Intel shareholders voted last week against the company’s compensation for its top executives, according to an regulatory filing published on Monday. The vote is advisory, and…

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#Advanced Micro Devices Inc. #Apple Inc. #Breaking News: Technology #Business #business news #Intel Corp. #Mobile #Pat Gelsinger #Technology

[thegamecollection]

D’YA WANT A CHIP?

If only this was as simple as nipping to your local fish shop, ehh... Although ironically we are left feeling a little salty at reports of the technological grail that is the Semiconductor Chip, and its shortage continuing into 2024.

For those of us still breaking our backs to try and secure a next gen console, be it the Xbox Series X/S or the PlayStation 5, this is not the news we’ve been wanting to receive. According to Pat Gelsinger, the CEO of Intel in a recent interview, the original shortage was projected to subside around 2023. However, the immense strain on the manufacturing equipment itself is where it’s gotten a lot trickier!

All things considered, these titans of gaming have still sold incredibly well with the Xbox shifting over 10 million units, and the PS5 not too far off the 20 million mark! It does leave us wondering just how many would have been sold if a world halting event like COVID hadn’t reared its ugly head... But this game is full of what ifs.

With the digital age in full swing, chips go into everything these days! Cars, phones, household appliances, not just our mouths! This is a prime example of how heavily certain industries have been hit by the pandemic, and how we’ll need to suffer a further wait for the luxuries we long to own.

Lets hope that we’re all in next-gen gaming paradise as soon as physically possible. Until then we’ll just have to actually talk to our families. Snakes and Ladders anyone?

-Jack

#ps5 #xbox series x #semiconductor chip #thegamecollection #TGC #news #gaming news #video games #blogs for gamers #tumblr gaming #gaming #uk gamers #pat gelsinger #Intel #Next Gen #console gaming #sony #microsoft #xbox #playstation

[itsnothingbutluck]

#pat gelsinger #Intel CEO Pat Gelsinger on the 15 Year History of AWS and Intel Driving Cloud Innovation

[mitchipedia]

I love that Pat Gelsinger’s plan for turning Intel around is to make things. He’s not turning to financial mumbo-jumbo, Web3, crypto, advertising, sprinkling AI magic dust and the other nonsense that Silicon Valley and Wall Street dudebros do when they want to grift the last nickel from a dying business.

Gelsinger’s idea is let’s make things! like Americans used to do!

I interviewed Gelsinger a couple of times when he was at VMware, and followed VMware closely during his tenure. He impressed me.

[coinatory]

Intel decided to discontinue the production of chips intended for use in Bitcoin mining.

Intel, a prominent US-based technology company, is reportedly planning to discontinue its line of Blockscale Bitcoin mining chips as part of its cost-cutting efforts. According to a report on April 18th, Intel will cease taking orders for the Blockscale 1000 Series ASICs by October 20th, and shipping will end by April 2024. This move is part of a strategy to prioritize the manufacturing of certain chips for external customers and reduce overall costs. Blockscale mining chips were launched in April 2022, with mining companies such as Argo Blockchain, Block, Hive Blockchain Technologies, and GRIID Infrastructure among the first to integrate the technology into their operations. Intel CEO Pat Gelsinger reported a 25% pay cut in February, with the company projecting annual cost reductions of up to $10 billion through cost-cutting

Read more on Intel decided to discontinue the production of chips intended for use in Bitcoin mining.

#cryptonewstoday #altcoin #bitcoin #blockchain #cryptocurrency #cryptomarket #ETH #ethereum #Intel #mining #news #regulations

[bhargavghervada]

Your attitude, more than anything, will influence your effectiveness. ~ Pat Gelsinger

#friday motivation #friday morning #friday vibes #friday #good morning #happy friday

[whiteguyswearinoculusrifts]

During the opening keynote at Intel's Innovation event in San Jose, Chief Executive Officer Pat Gelsinger unveiled a score of details about the upcoming Meteor Lake client platform. Intel's Meteor Lake marks the beginning of a new era for the chipmaker, as they move away from the chaotic Intel 7 node and go into a rollout of their Foveros 3D packaging with EUV lithography for their upcoming client mobile platform. Meteor Lake uses a tiled, disaggregated chiplet architecture for its client-centric processors for the first time, changing the very nature of Intel's consumer chips going forward. And, according to Intel, all of these changes have allowed them to bring some significant advancements to the mobile market. Intel's first chiplet-based consumer CPU breaks up the common functions of a modern CPU into four individual tiles: compute, graphics, SoC, and an I/O tile. Within the makeup of the compute tile is a new pair of cores, a P-core named Redwood Cove and a new E-core called Crestmont. Both these cores promise IPC gains over their previous counterparts, but perhaps the most interesting inclusion is a new type of E-core embedded directly into the SoC tile, which Intel calls 'Low Power Island.' These new LP E-cores are designed with the idea that light workloads and processes can be taken off the more power-hungry compute tile and offloaded onto a more efficient and lower-powered tile altogether. Other major additions include a first-for-Intel Neural Processing Unit (NPU), which sits within the SoC tile and is designed to bring on-chip AI capabilities for workloads and inferencing, paving the way for the future. With Meteor Lake, Intel is aiming to put themselves in a more competitive position within the mobile market, with notable improvements to compute core hierarchy, Intel's Xe-LPG Arc-based graphics tile looking to bolster integrated graphics capabilities, and an NPU that adds various AI advantages. Meteor Lake also sets the scene for Intel and modular disaggregation, with Foveros 3D packaging set to become a mainstay of Intel's processor roadmap for the future, with the Intel 4 process making its debut and acting as a stepping stone to what will become Intel's next mainstay node throughout its fabs, Intel 3. Intel Meteor Lake: Intel 4 Using Foveros 3D Packaging Intel's Meteor Lake architecture is not just another iteration in the long line of processor advancements; according to the company it's a revolutionary leap forward. Eloquently put by the executive VP and GM of Intel's Client Computing Group (CCG), Michelle Johnston Holhaus, at Intel's Tech Tour 2023 in Penang, Malaysia, she remarked that Intel had reached an inflection point in their client roadmap. Unveiling more details about Meteor Lake at the Intel Technology Tour in Malaysia, the architecture is an advancement from its current client processors regarding performance as we advance through Intel's '5 nodes in 4 years' roadmap. Meteor Lake is built upon Intel's disaggregated architecture pushed through by Foveros packaging. This is designed to optimize both performance and energy efficiency. The architecture itself consists of four unique and distinct tiles connected via Intel's Foveros 3D packaging technology. This includes the compute tile, which is built on Intel 4, while the graphics tile is built on TSMC's N5 node. The other two tiles Intel implements within Meteor Lake are the SoC tile which acts as the medial hub through the embedded NOC. This is the first time Intel has used a Network-on-Chip (NOC) on their client processors, which is a simplified approach to the NOC on their existing Agilex FPGAs. While on Agilex, the NOC is individualized into different NoC targets and switches within the substructure of the NoC, on Meteor Lake, it directly connects to the I/O fabric through the IoC, which then goes into the I/O fabric. The NOC itself is directly connected to the graphics tile, compute tile, and other components within the SoC. This modular approach allows for a ground-up and scalable power management architecture that supports disaggregation, enabling each tile to function independently. This disaggregated design prioritizes performance by negating bandwidth bottlenecking through things like the I/O on a monolithic design and targets enhanced power efficiency. Perhaps the most notable element of disaggregation is that Intel can select specific silicon processes for each tile and isn't limited to one process node. On top of the power efficiency and package area benefits of a tiled architecture, it is cheaper for Intel to manufacture CPUs with fewer masks through EUV, but it allows Intel to scale out new IP into future products while keeping the same base, which is another cost-saving factor (for Intel). Compared to mobile Raptor Lake, which was done using Multi-Chip Packaging (MCP), Meteor Lake uses Foveros BGA packaging and offers low-power die-to-die interconnects, which Intel confirmed has a small power penalty of between 0.15 and 0.3 picojoules (pJ) communicating from tile to tile. Some of the advantages of Foveros include better customizability through tiling, which allows Intel to manufacture chips and implement specific tiles and IP depending on the grade of the chip, etc., low power with more I/O, or high-end tiles with all the latest gadgets and gizmos. With the Intel 7 node not being as viable as they would have hoped, Intel promises higher wafer yield on Intel 4, which uses less wafer space for logic-based silicon. Power management is done using a scalable power management system that supports the independent functioning of each tile. Coordination between multiple power management controllers (PMC) and system software is designed to be optimized for various workloads. Intel's Meteor Lake architecture also introduces a new scalable fabric to improve energy efficiency and extend bandwidth in areas that have been previously bottlenecked, such as I/O. Touching more on the power controllers within the Meteor Lake architecture, Intel has integrated independent Power Management Controllers within each of the tiles. As part of the disaggregation of using Foveros, each tile needs to be independently power managed, and using PMCs on the NOC, the I/O fabric, as well as each tile allows power management to be agnostic depending on the number of the cores on each package. Meteor Lake itself represents a monumental architectural shift, not just a mere incremental update, as it represents the most significant architectural transformation in client processors in four decades. This is because it's the first client processor to be made using chiplets instead of a monolithic design. The architecture is designed to be the cornerstone of Intel's strategy to push PC innovation for the next decade. Looking at some of the finer details of Intel's Meteor Lake architecture, it uses Intel's Foveros packaging technology, which uses 3D chip stacking to tackle the pitfalls of traditional 2D chip layouts. As we can see from the above disclosure from Intel at Hot Chips 2023, the top and bottom layers have bumps for interconnecting each die together. Using the Foveros FDI packaging offers a low-voltage complementary metal oxide semiconductor (CMOS) interface, which means the power circuitry can be run with lower voltages and, thus, with a lower power envelope. Another benefit of FDI is both synchronous and asynchronous signaling, which means signal transmission can handle fully duplexed data blocks. Constructing a Meteor Lake SoC includes a package substrate, which is the foundation for the base tile to sit onto, which uses the Foveros Die Interconnect (FDI). The base tile has a 36µm die to die pitch with metal layering and a 0.15 to 0.3 pJ operating power at 2 GHz; this may fluctuate or vary depending on voltages, amps, and frequency. As it's a base tile that isn't an active chiplet itself, its only function is to serve as a base for all of the various logic, and metal layers for the chiplets to be placed upon. The makeup of Intel's Meteor Lake architecture uses four distinct tiles to create a Meteor Lake CPU. This includes a Compute, SoC, GPU, and an I/O tile, all with distinct uses, capabilities, and flexibility in regard to IP. Power management also gets a revamp. With disaggregation through Intel's Foveros packaging technology, each tile in Meteor Lake requires its own power management. Intel's solution is a hierarchical power management system that uses Power Management Controllers on the NoC, IO fabric, and each individual tile. Over the next few pages, we'll give an insight into each of the four tiles, what each tile brings to the table, and more about the various technologies driving innovation through Meteor Lake.

[pressnewsagencyllc]

White Home awards Intel $8.5 billion in CHIPS Act funding

The White Home on Wednesday introduced it is going to present Intel with $8.5 billion in funding by way of the CHIPS Act. The infusion of money, Intel (INTC) says, will fund websites at areas together with the large complicated the corporate is constructing in Ohio, crops in Arizona and New Mexico, and its analysis and growth facility in Oregon. The $52.7 billion CHIPS Act goals to deliver…

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#intel #Pat Gelsinger #SEMICONDUCTOR MANUFACTURING #the white house

[4gspeed]

Theo VideoCardz, nhiều khả năng Intel sẽ công bố bộ xử lý dòng Arrow Lake dành cho PC và máy tính xách tay tiêu dùng. Trong trường hợp này, Computex 2024 sẽ là cơ hội tuyệt vời để các nhà sản xuất bo mạch chủ trưng bày thế hệ sản phẩm mới với socket LGA 1851, vốn được sử dụng bởi chip Arrow Lake.Pat Gelsinger sẽ có bài phát biểu vào ngày 4.6 trong khuôn khổ Computex 2024Cũng theo thông báo từ TAITRA, CEO Intel Pat Gelsinger sẽ có bài phát biểu tại Computerx 2024 diễn ra vào ngày 4.6. Gelsinger được cho là sẽ trưng bày một thế hệ sản phẩm mới dành cho trung tâm dữ liệu và các sản phẩm phân khúc người tiêu dùng như là một phần của chủ đề trí tuệ nhân tạo (AI) mà triển lãm năm nay hướng đến.Hơn nữa, Intel sẽ nói về cách công ty sử dụng các dòng sản phẩm Xeon, Gaudi và Core Ultra để giải quyết các vấn đề liên quan đến trí tuệ nhân tạo (AI). Giống như các chip Meteor Lake hiện tại, bộ xử lý Arrow Lake trong tương lai sẽ được trang bị bộ tăng tốc AI (NPU) đặc biệt.Trước đó, người đứng đầu AMD Lisa Su cũng đã xác nhận bà sẽ tham gia triển lãm Computex 2024 diễn ra tại Đài Loan vào giữa năm nay. Bà sẽ có bài thuyết trình vào ngày 3.6. AMD dự kiến sẽ công bố kiến trúc bộ xử lý Zen 5 mới tại sự kiện lần này.Được biết, Computex là một trong những sự kiện công nghệ lớn nhất năm, nhận được sự quan tâm lớn của cả người dùng lẫn giới công nghệ. Đây là một triển lãm thương mại ICT lớn nhất châu Á được diễn ra thường niên tại Đài Bắc (Đài Loan) kể từ năm 2000 đến nay.

[twiainsurancegroup]

[ujjinatd]

A pesar de aumentar a 16,86 millones de dólares, la remuneración del CEO de Intel, Pat Gelsinger, aún palidece en comparación con la de Lisa Su de AMD. En breve: Como director ejecutivo d... https://ujjina.com/a-pesar-de-aumentar-a-1686-millones-de-dolares-la-remuneracion-del-ceo-de-intel-pat-gelsinger-aun-palidece-en-comparacion-con-la-de-lisa-su-de-amd/?feed_id=578009&_unique_id=660ab0db60d6f

[plethoraworldatlas]

Intel, the largest chip maker in America, with 2023 revenues of $54 billion, has just been awarded an $8.5 billion grant from the federal CHIPS and Science Act, plus $11 billion in favorable loans.

In addition to badly needed microchips, Intel produces totally useless stock buybacks. On its website the company proudly proclaims to have spent $152 billion on stock buybacks since 1990. That’s not a typo: $152,000,000,000. Which is why I call it "Stock Buybacks Я Us."

Intel took $152 billion of its revenues, some portion of which could have been used for R&D and building new microchip facilities in the U.S. as well as paying workers more, and instead funneled it to its largest Wall Street stockholders and corporate executives, enriching the top fraction of the top one percent.

A company repurchasing its own shares sees earnings per share rise because there are fewer shares in circulation. Share prices rise, though nothing new is made, and the largest stockholders, including top Intel executives, cash out with eye-popping profits. Intel CEO Pat Gelsinger hauled in $179 million in 2021, most of it coming from stock-related compensation.

#intel #stock market #Stock buybacks #shareholders

[thewirely]

At the forefront of the semiconductor industry, Intel has recently announced a strategic shift in its approach to chip production, under the leadership of CEO Pat Gelsinger. During the Meteor Lake chip launch in New York, Gelsinger hinted at Intel's ambitious plan to integrate five new nodes in four years, concluding in 2025. This plan includes the development of the Intel 7, Intel 4, Intel 3, Intel 20A, and Intel 18A processes, which are expected to be utilized in a range of server processors. In a significant departure from its traditional release schedule, Intel indicated a new strategy of shipping products as they become ready. This shift is seen as an effort to help Intel catch up with its rivals in the fiercely competitive semiconductor market. The company aims to provide customers with more options by offering multiple generations of chips simultaneously, catering to the growing demand for customized products. Intel is keenly focusing on integrating emerging technologies like artificial intelligence and chiplets. The company's chiplet technologies are particularly noteworthy, as they could potentially blur the lines between server and client products. This flexibility would enable Intel to assemble chips based on specific customer needs, facilitating the production of custom chips tailored for different industries. “As you go to chiplets, you’re not doing as large a die, and you have smaller die. In fact, when we go to 18A, a finish of our five nodes in four years, we’re almost concurrently tapping out the client and server parts. That’s something we’ve never done before,” Gelsinger explained, highlighting the innovative nature of this approach. Gelsinger also touched on Intel's advancements in packaging technologies, such as Foveros, a wafer-level 3D stacking solution that offers enhanced performance in a smaller footprint. “We look at the Core Ultra packaging — we’re innovating on Foveros packaging but we’re going to be using that on the next generation server part in this chiplet architecture, there are so many ways to blur the lines between many of our designs,” Gelsinger stated, emphasizing the potential for innovation in chip design and manufacturing. Intel's unique position as the only fully integrated chip company sets it apart in the industry. While rivals like Nvidia, ARM, AMD, Qualcomm, and Apple compete for market share, Intel not only produces its own chips but also offers manufacturing services to firms designing their own processors. This dual strategy could be crucial in ensuring Intel's continued relevance and success in the rapidly evolving semiconductor landscape.

[enterprisewired]

Biden Administration Secures Massive Investment in U.S. Chip Manufacturing

In a significant move aimed at bolstering domestic semiconductor production, the Biden administration has finalized a groundbreaking agreement with Intel, unlocking up to $8.5 billion in direct funding and an additional $11 billion in loans. This funding will be directed toward establishing computer chip Manufacturing plants across four states: Arizona, Ohio, New Mexico, and Oregon. Intel, in response, has pledged that this substantial investment, coupled with additional commitments, will yield a total of 30,000 jobs in manufacturing and construction.

Strengthening Domestic Chip Production

The announcement marks a pivotal moment in President Joe Biden’s economic agenda, as he gears up to showcase this monumental investment during his visit to Intel’s campus in Chandler, Arizona. With the looming specter of the upcoming election, particularly in pivotal states like Arizona, Biden aims to underscore the tangible impacts of his economic policies, which he believes have been underappreciated by many voters.

The funding is made possible through the bipartisan CHIPS and Science Act, a legislative milestone signed into law in 2022, allocating $200 billion towards enhancing domestic semiconductor production. Commerce Secretary Gina Raimondo emphasized that this agreement positions the United States to produce 20% of the world’s most advanced chips by 2030, addressing critical national security and economic concerns stemming from overreliance on foreign chip manufacturers.

Transformative Implications for Industry and Economy

The infusion of funds into U.S. chip manufacturing comes at a crucial juncture, with global geopolitical tensions and supply chain disruptions underscoring the imperative of securing semiconductor production domestically. Intel’s CEO, Pat Gelsinger, hailed this development as a defining moment not only for the company but also for the semiconductor industry and the nation as a whole, likening the CHIPS Act to pivotal industrial policy legislation akin to initiatives seen during World War II.

The strategic allocation of funding across multiple states underscores the administration’s commitment to fostering widespread economic growth and job creation. In addition to job opportunities within Intel, the investment is poised to stimulate ancillary industries and local economies, generating an estimated 50,000 indirect jobs through supplier networks and related businesses.

Political Ramifications and Future Outlook

With the 2024 presidential campaign heating up, Biden’s emphasis on job creation and economic resurgence through initiatives like the CHIPS Act serves as a direct rebuttal to the policies of his predecessor, Donald Trump. The administration’s swift action in disbursing federal funds underscores a concerted effort to demonstrate tangible progress on key policy initiatives, particularly amidst tepid public sentiment regarding Biden’s economic stewardship.

Looking ahead, the Biden administration remains steadfast in its commitment to further bolstering the semiconductor industry, with calls for additional legislation to sustain momentum in domestic chip manufacturing. By incentivizing investments and prioritizing workforce development, the administration aims to fortify the nation’s technological capabilities while fostering economic resilience in the face of global challenges. Through strategic partnerships with industry leaders like Intel, the United States is poised to reclaim its position as a global leader in semiconductor innovation and production.

Also Read: IBM Develops Groundbreaking Brain-Inspired Chip for Enhanced AI

#uschipmanufacturing #BidenAdministration #CHIPSAct #intelinvestment #semiconductorindustry #jobcreation #economicgrowth #NationalSecurity

[bitrise-co-in]

Intel's new CEO, Pat Gelsinger, remains calm about Nvidia and its other competitors. Nvidia announced it Processor Nvidia Grace to conquer the space of data centers and supercomputers. This processor is 10 times faster t... bitrise.co.in

#Processor